Bonder.png

Equipment : Flexible Thermoelectric Module Bonding System

Model  : Custom Manufactured (Wonik IPS)

 

Application:

Thermoelectric device bonding

  - bonder with aligner

 

General information

-Wafer size (Square) : Maximum 20 cm x 20 cm (Possible to manufacture large size device)
-Maximum working temperature : 400℃
-High heating rate : 150℃/min
-High cooling rate : 90℃/min
-Pressure control resolution : 1 kPa step
-Gas line : N2
-Vacuum degree : 10-3 torr

 

-  Align accuracy : 50㎛